1. 2. 3. material content data sheet sales product name sak-xc164cm-16f20f ba issued 29. august 2013 ma# MA000789522 package pg-lqfp-64-4 weight* 379.61 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 19.143 5.04 5.04 50427 50427 leadframe non noble metal magnesium 7439-95-4 0.179 0.05 471 inorganic material silicon 7440-21-3 0.775 0.20 2042 non noble metal nickel 7440-02-0 3.578 0.94 9426 non noble metal copper 7440-50-8 114.739 30.23 31.42 302252 314191 wire noble metal gold 7440-57-5 1.871 0.49 0.49 4929 4929 encapsulation organic material carbon black 1333-86-4 1.150 0.30 3030 plastics epoxy resin - 31.052 8.18 81800 inorganic material silicondioxide 60676-86-0 197.814 52.13 60.61 521095 605925 leadfinish non noble metal tin 7440-31-5 4.118 1.08 1.08 10847 10847 plating noble metal silver 7440-22-4 1.710 0.45 0.45 4506 4506 glue plastics epoxy resin - 0.697 0.18 1835 noble metal silver 7440-22-4 2.786 0.73 0.91 7340 9175 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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